CERAPHASE 60 PHASE CHANGE THERMAL INTERFACE FILM

Ceraphase 60 Phase Change Thermal Interface Film

Ceraphase 60 is a free standing ceramic filled 60C phase change thermal film designed to provide heat transfer for a variety of power module packages, LED assemblies, CPU/Sink or any electronics cooling application where efficient and reliable heat transfer is required. Available standard as either a 5 mil, 8 mil or 12 mil free standing phase change film in either sheet or die cut format. Upon initial phase change, Ceraphase 60 begins its controlled flow from its original pre-formed die cut size adjusting for surface irregularities and flatness conditions leading to improved thermal performance. This also includes a reduction of the bond line thickness as mounting pressures are increased.

Ceraphase 60 Film Features and Benefits
  • Thermal conductivity - 1.3 W/m-K
  • 60C phase change temperature
  • Ceramic (dielectric) thermally conductive filler design
  • Uniform free standing film thickness
  • Thixotropic -silicone free compound design
  • Easy to apply | release liner tab system
  • Excellent replacement for thermal greases
  • Reworkable after phase change
  • Polyimide film or metal foil coating optoins available
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
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Material Thickness

  • C60-5 (0.13mm)
  • C60-8 (0.20mm)
  • C60-12 (0.30mm)
Format: Free standing phase change thermal inteface film with release liner.

Standard Cross Section

Typical Applications

General Specifications

  • Power Modules | IGBT
  • MOSFET
  • Memory Modules
  • CPU | Heat Sink Assembly
  • LED Assembly
  • Automotive Electronics
  • Consumer Electronics
  • Medical Device Electronics
  • Heat Pipe Assembly
  • Servo Drive Controls
  • Power Electronics
  • Phase Change Temperature: 60C
  • Thermal Conductivity: 1.3 W/m-K
  • Compound Flow Design: Thixotropic
  • Maximum Operating Temperautre: 125C
  • Material Color: White
  • Material Surface: Slight Tack

Compliance

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant

Release Liner | Thermal Pad Transfer System

When designing Ceraphase 60 to achieve excellent thermal transfer results, the thermal performance was not the only target. An additional key advantage in using Ceraphase 60 is the offering of the TIMTEL Die Cut Thermal Pad Transfer System. The purpose of this die cut design was to avoid common installation issues typically experienced by similar phase change thermal pads on the market place today such as not releasing properly from the liner and pad tearing.

Thermal Impedance

Thermal impedance testing performed per ASTM D5470 Test Method. Contact us for additional pressure range figures.
C60-5 (0.13mm)
10 PSI - 0.070 oC-in^2/W 25 PSI - 0.046 oC-in^2/W 50 PSI - 0.035 oC-in^2/W 80 PSI - 0.029 oC-in^2/W
C60-8 (0.20mm)
10 PSI - 0.095 oC-in^2/W25 PSI - 0.070 oC-in^2/W50 PSI - 0.058 oC-in^2/W80 PSI - 0.050 oC-in^2/W
C60-12 (0.30mm)
10 PSI - 0.130 oC-in^2/W25 PSI - 0.115 oC-in^2/W50 PSI - 0.105 oC-in^2/W80 PSI - 0.095 oC-in^2/W

Other Information

Material Formats
Sheets Die cut invidiual pads Multiple die cut pads per master liner
Optional Substrate Coatings (single side)
Kapton MT Polyimide Kapton MT+ Polyimide Aluminum foil Copper foil
Storage | Shelf Life
Store material in a cool, dry location at 80F / 27C or below in original packaging until use. Shelf life is 3 years from date of manufacture.
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