SILTEL SL-TC20.0 THERMALLY CONDUCTIVE SILICONE FILM
SILTEL SL-TC20.0 Ultra-High Thermally Conductive Gap Pad
SILTEL SL-TC20.0 offers an ultra high thermal conductivity of 20.0 W/m-K packaged within a soft and compliant non-dielectric thermal film design. SL-TC20.0 is suitable for a range of electronic packages and heat sinks where large gaps and big flatness tolerances exist.
SL-TC20.0's highly filled thermally conductive form offers high anisotropic thermal conductivty packaged with a conformal surface structure and softness that is gauranteed to provide excellent compliance even at low pressures.
SL-TC20.0 is ideal for non-dielectric applications that require ultra-high thermal performance, gap filling and high surface compliance.
SILTEL SL-TC20.0 Features and Benefits
- Ultra High Thermal Conductivity - 20.0 W/m-K
- Anisotropic thermal film design
- Non-dielectric thermal pad solution
- Available with a secondary dielectric film barrier (optional)
- High surface compliance and extremely soft
- Shock absorbing
- Excellent thermal contact
- Excellent chemical resistance
- Offers high temperature stability
- Ideal for a range of surface flatness conditions
- Available with discrete tack placement die cut or sheet
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
Material Thickness
- SL.20-TC20.0 - 0.20mm | 0.008"
- SL.50-TC20.0 - 0.50mm | 0.020"
Format: Free standing thermally conductive particle filled silicone film (unsupported)
Standard Cross Section
Typical Applications
General Specifications
- MOSFET and IGBT
- Motor - Power Control Units
- Automotivce Management Systems
- Power Supply | UPS Systems
- Power Semiconductor
- Solar Systems
- Power Diodes
- AC/DC Converters
- Switch Mode Power Supplies
- Large Gaps or High Surface Flatness Tolerances
- Thermal Conductivity: 20 W/m-K
- Material Type: silicone
- Support: none (free standing)
- Operating Temperature: -40C to 150C
- Material Color: Black
- Material Surface: Dry Coating
- Tack Back Options: T1 (discrete placement on sheet or die cuts, adhesive dots or adhesive strips)
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SL.20-TC20.0 0.20mm | 0.008"
Thermal Impedance
10 PSI - 0.030 oC-in^2/W
15 PSI - 0.017 oC-in^2/W
35 PSI - 0.007 oC-in^2/W
Hardness
60 (shore 00)
Volume Resitivity
<50,000 ohm-cm
SL.50-TC20.0 0.50mm | 0.020"
Thermal Impedance10 PSI - 0.042 oC-in^2/W15 PSI - 0.027 oC-in^2/W35 PSI - 0.018 oC-in^2/W
Hardness60 (shore 00)
Volume Resitivity<50,000 ohm-cm
Hardness60 (shore 00)
Volume Resitivity<50,000 ohm-cm
Other Information
Material Formats
Sheets
Die cut invidiual pads
Multiple die cut pads per master liner
Available Tack Backings
T1 - discrete placement on sheet or die cuts. Adhesive can be placed as adhesive dots or adhesive strips.
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.