EMI-PHASE 60 PHASE CHANGE MATERIAL PAD
EMI-Phase 60 Phase Change Shielding Pad
EMI-Phase 60 utilizes the benefits of phase change technology combined in a multi-layer construction. Through the use of a copper foil or graphite foil insert and exposed ground connection configuration on the exterior or interior of the pad, EMI-Phase 60 suppresses radiated emissions generated in high frequency transistor applications in addition to providing the low interface surface resistance provided by the phase change compound system.
EMI-Phase 60 enables radiated EMI to be suppressed at its source as the captured EMI is routed via a connection point to the ground plane.
EMI-Phase 60 is a fully customizable multi-layer product offering a range of dielectric layer and conductive foil insert material types and thicknesses. EMI-Phase 60 can be completely tailored to a specific application requirement or configuration using low cost tooling.
EMI-Phase 60 pre-formed pads are shipped in clean, sizable packs and instantly ready for installation.
EMI-Phase 60 Features and Benefits
- Controls radiated emissions
- Effective shielding performance
- 60C phase change temperature | thixotropic coating
- Efficient thermal transfer
- Low interfacial surface resistance (phase-change)
- High dielectric strength (multiple insulation layer options)
- Excellent mechanical properties
- Excellent handling characteristics
- Standard and custom designs
- Multiple copper or graphite foil insert thickness options
- Multiple dielectric film thickness options
- Reworkable after phase change
- Ideal for many types of transistor | device outlines
- Suited for high frequency switching devices
- Capable of replacing the use of multiple material types
Incorporating Phase Change into EMI-Shielding
Since EMI-Phase 60 is manufactured with a specific thickness and die cut configuration, it can be placed instantly and immediately ready for component mounting. Due to it’s thixotropic compound design, compound is held within the interface with no worries of run-out into unwanted areas during normal device/component operation. Upon initial phase-change of the EMI-Phase 60 compound, it begins it’s wetting out process allowing it to fill in any microscopic surface imperfections or uneven surface conditions across the interface as well a drive out any trapped air leading to increased thermal transfer performance keeping the device/component cool and reliable.
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
Exterior Insulation Film
- DiaPhase 60 (Kapton MT Supported Phase Change Film)
DiaPhase 60 Insulation Thicknesses: 0.051mm (0.002") to 0.127mm (0.005")
- UltraPhase 60 (Kapton MT+ Supported Phase Change Film)
UltraPhase 60 Insulation Thicknesses: 0.038mm (0.0025") to 0.076mm (0.003")
Interior Conductive Insert
- Copper Foil - 0.025mm to 0.127mm (0.001" to 0.005")
- Tin Coated Copper - 0.076mm to 0.127mm (0.003" to 0.005")
- Graphenol HS - 0.032mm to 0.070mm (0.00126" to 0.00257")
Graphenol HS can be considered for applications not requiring a solder joint to a ground connection lead.
General Configuration Type 1: exposed flat or formed ground contact lead
General Configuration Type 2: interior ground contact
Mounting Holes: EMI-Phase 60 thermal pads are available with or without interior mounting through holes
Flat or Formed Leads: exterior ground connection leads can be supplied flat or formed per customer requirement.
Typical Applications
General Specifications
- Transitor Devices (TO-218, TO-220, TO-247, TO-264, etc.)
- Diodes / Relays
- Power Supply | UPS Systems
- Custom Designed Electronic Assemblies
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
- Phase Change Temperature: 60C
- Silicone-Free | Solvent-Free Compound Design
- Compound Flow Design: Thixotropic
- Volumetric Expansion: 15% (phase change coating)
- Maximum Operating Temperature: 150C
- Material Color: Orange
- Material Surface: Dry Compound Coating @ Room Temp
- Tack Options: Yes (PSA options listed at bottom)
Thermal Impedance
Due to the number of potential multi-layer material combinations available with EMI-Phase 60, thermal impedance testing will only be available after customer designates desired material construction. Testing is performed within ASTM D-5470. Specimens are tested within a 50mm x 50mm (2.00” x 2.00”) pad size only.
Other Information
Material Formats
Assembled Individual Pads
Due to customizable nature of EMI-Phase 60, material is not available for sampling in a bulk sheet or roll format.
Available Tack Backings
A - low tack repositionable
T20 - thermally conductive tack
Adhesive options listed above are for EMI-Pad surface mounting (surface of pad)
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.
Request Sample or Technical Data Sheet
Kapton is a registered trademark of Dupont Corporation