TIMtelligent Thermal Materials
Thermal Material Solutions
As our world demands smaller and more powerful electronic packages, TIMTEL continuously innovates to meet those thermal demands. We offer an extensive line of standard thermal management materials as well as custom thermal material formulations, constructions and die cut designs targeted towards specific thermal application and installation requirements.
We support multiple market segments across the electronics assembly market including automotive, consumer electronics, alternative energy, medical electronics and automation.
To get started, please select from one of the product categories below.
Power Module
Module / Cold Plate Assembly
Film and Printable Formats
Non-Dielectric & Dielectric Solutions
Power Inverter
Dielectric Film Solutions
Non-Dielectric Film Solutions
Automotive Assembly
Energy Storage
High Power Density Storage
Battery Assembly
Thermal Spreading Solutions
LED
Thermal Transfer Films
Heat Spreading Films
Thermal Tape - Laminations
CPU-Heat Sink
TIM2 Thermal Solutions
CPU - Heat Sink Mounting
Phase Change Pad Solutions
MOSFET Device
Heat Sink/Case Sink Assembly
Multi-Unit Pad Solutions
Dielectric/Non-Dielectric Pads
Timtel Thermal Management Products
Phase Change TIM
Free standing phase change films and phase change coated substrates designed to provide low interfacial surface resistance for efficient heat transfer.
Phase Change Dispensable
Phase change compounds in both bar and cartridge styles. Bar styles for dry swiping of thermal compound and cartridge for printing/dispensing at room temperature.
Thermal Silicone Films
Thermally conductive ceramic filled silicone films with either polyimide film or fiberglass reinforcement supports. Range of thicknesses and tack options.
Thermal Gap Pads
Gap filling thermal pads in a range of durometers, thermal performances as well as tack configurations. Available as sheets or pre-formed to your specific outline requirement.
Thermal Adhesives
Thermally conductive adhesive films in a free standing film or substrate supported format. Substrates include non-dielectric and dielectric options in a range of thicknesses.
Heat Spreader Films
Ultra-high in-plane thermally conductive graphite films offering phase change coatings for efficient heat transfer into the heat spreading film. Single side coating and tack options available.