Thermally Conductive Heat Spreading Film | Graphenol HS
Graphenol HS offers an ultra-high in-plane thermal conductivity packaged with superior handling characteristics over traditional pyrolytic graphite films available on the market today. Graphenol HS's enhanced durability properties prevents breaks and film shattering that can typically occur in other brittle pryolitc graphite films.
Graphenol HS is a non-metallic lightweight thermal interface material ideal for a range of applications including consumer mobile electronics (mobile phone, tablets, laptops), battery thermal management and medical device electronics assembly.
Graphenol HS's flexible design allows for bending along a range of angled planes without worry impacting its lateral heat flow. Graphenol HS film can be paired easily with adhesive backings for enhanced ease of placement assembly as well as barrier film laminations to acheive a variery of properties (polyimide film, PET film, conformal film backings).
Graphenol HS exhibits ultra-low water absorption allowing it to operate reliably within demanding environmental temperature and humidity conditions. Due to its high electromagnetic shielding capability, Graphenol HS is suitable for EMI-shielding applications especially at frequencies of 5GHz and above.
Graphenol HS Pyrolytic Graphite Film Features and Benefits
- Ultra-high lateral (XY) thermal conductivity: 1,500 W/m-K
- Thru-plane (Z) thermal conductivity: 5.0 W/m-K
- Non-Dielectric Thermal Pad
- Lightweight TIM pad solution
- Enhanced durability - resistant to handling
- Flexible - easily navigate angles and bends without impact
- Excellent EMI-shielding capability
- Electrically conductive film properties
- High temperature resistant up to 500C
- Low water absorption characteristics
- High thermal diffusivity
- Chemically resistant
- 100% surface backed, discrete or edge adhesive tack options
- Insulating or conductive film lamination backing options
- Offers a 100% non-metallic TIM pad solution
- Excellent replacement for copper foil and other metallic foils
Film Substrate Thickness
- HS-32 - 0.032mm | 0.00126"
- HS-40 - 0.040mm | 0.00157"
- HS-70 - 0.070mm | 0.00276"
Format: Graphenol HS pyrolytic film only - dry surface
Standard Cross Section
Graphenol HS Lateral Heat Flow Capability
Graphenol HS film has a much more efficient heat spreading capability than copper, aluminum or polyimide film within the same relative thickness
Graphenol HS lowers heat source (hot spot) temperatures by 201.1% over thermally conductive polyimide films
Graphenol HS lowers heat source (hot spot) temperatures by 61.5% over aluminum foil
Graphenol HS lowers heat source (hot spot) temperatures by 53.5% over copper foil
Graphenol HS Heat Flow Efficiency
Due to the uniformity of the internal graphite layers within Graphenol HS, it exhibits extremely high heat transfer efficiency. As shown in the graph below, heat dissipation begins to occur much quicker with Graphenol HS when compared to copper and polyimide film allowing for devices to operate at cooler temperatures sooner. This type of heat dissipation capability makes Graphenol HS ideal for both high or low frequency (on/off) applications.
Graphenol HS Shielding Capability
Graphenol HS can be considered for applications that require a high performing EMI-shielding solution especially at frequencies at or above 5GHz. Graphenol HS provides the ability to offer EMI-Shielding without the use of a metallic shielding material. Contact us for applications that require a multi-layer insulation/shield/insulation configuration.
