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Phase Change Heat Spreading Film | Graphenol PCM 50
Graphenol PCM 50 is a new dual function thermal interface material that brings together the distinct features of an ultra-high lateral heat spreading film packaged with the ultra-low surface resistance capability of our thermally conductive phase change compound. Graphenol PCM is suitable for many types of standard thermal applications or lateral heat flow requirements due to its dual function heat transfer capability (in-plane and enhanced thru-plane with the phase change coating).
Graphenol PCM differs from other pyrolytic based TIM materials on the market today by also offering signficantly better handling and installation characteristics. Graphenol PCM can be handled or processed without worry of breaks and/or shattering typically found in traditional pyrolytic graphite films. Due to its robust film design, Graphenol can be considered for applications that require the material to navigate bends and angles that may exist within interface with no impact in lateral heat spreading capability.
The unique 50C phase change compound coating dramatically decreases surface resistance (especially at low pressures) allowing for efficient heat transfer from device into the heat spreading substrate allowing for efficient ultra-high lateral spreading along the XY plane. This same principal is true when heat traveling along the plane of the heat spreader and then dissipated through the phase change compound into the heat dissipating heat sink/case sink.
Graphenol PCM is available in a range of construction configurations (single side coating, adhesive backed, barrier film laminates) as well as delivery formats including rolls, sheets or die cut (individuals or reels).
Graphenol PCM 50 Features and Benefits
- Ultra-high lateral (XY) thermal conductivity: 1,500 W/m-K
- Thru-plane (Z) thermal conductivity: 5.0 W/m-K
- Non-Dielectric Thermal Pad
- 50C phase change coating
- Offers low interface surface resistance (phase change coating)
- Dual function capability (In-Plane XY and Thru-plane Z)
- Thixotropic compound design - silicone free design
- Designed for a range of flatness conditions
- Lightweight TIM pad solution
- Enhanced durability - resistant to handling
- Flexible - easily navigate angles and bends without impact
- Suitable for lateral device/sink setups or traditional TIM setups
- Excellent EMI-shielding capability
- Double coated and single coated phase change configurations
- Discrete phase change compound placement available
- 100% surface backed, discrete or edge adhesive tack options
- Offers a 100% non-metallic TIM pad solution
Base Substrate Thickness
- HS-32 - 0.032mm | 0.00126"
- HS-40 - 0.040mm | 0.00157"
- HS-70 - 0.070mm | 0.00276"
Coating Thickness (per side)
- F50-05 - 0.013mm | 0.0005" per side
- Contact us for custom coating thickness options
Standard Cross Section
Format: Graphenol HS pyrolytic graphite film substrate coated both sides with a uniform thickness of phase change compound.
Graphenol PCM (phase change coated) versus uncoated (dry) Graphenol HS
- Applying the F50-05 type phase change compound coating to both sides of the Graphenol HS film substrate dramatically decreases surface resistance and offers a significant reduction in thermal impedance especially at low pressures. Single side phase change also provides a signficant decrease in surface resistance when a dry film surface is required on the opposite side.
- The F50-05 type phase change coating allows for effective heat transfer of the heat into the heat spreader substrate itself followed then with efficient and ultra-high lateral spreading along the XY plane. This same principal is true when heat traveling along the plane of the heat spreader is then dissipated at the heat sink/case sink (cooling) location.
- The reduction in surface resistance gets the heat into the spreader film substrate significantly quicker than an uncoated film with a dry (no phase change) interface junction.