INTRAGRAPH PCM 50 PHASE CHANGE HEAT SPREADING FILM
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Phase Change Thermal Interface Material | IntraGraph PCM 50
IntraGraph PCM 50 combines the features of phase-change technology with low cost but effective graphite film substrate. The IntraGraph PCM 50 substrate is a 98% pure graphite designed with a flake like structure exhibiting anisotropic thermal conductivity in both the XY (in-plane) and Z (thru-plane) directions. When packaged with the PCM 50 phase change coating, IntraGraph offers lower overall thermal resistance compared to an uncoated graphite film. Upon phase change at 50C, the compound coating begins to flow adjusting for flatness, expelling air from within the interface and filling in any surface imperfections that may exist all leading to enhanced thermal transfer performance from device to sink.
IntraGraph PCM 50’s offers a low density substrate that makes it an ideal candidate for applications where weight sensitivities may exist. IntraGraph PCM 50 offers excellent handling in roll or die cut pad form without worry of breaking or shattering that can often occur in other commercial type graphite film products during converting or installation.
IntraGraph PCM 50 is readily available in 2 standard thicknesses in rolls, sheets or die cut to a specific customer outline.
IntraGraph PCM 50 Features and Benefits
- 50C phase change coating
- Silicone-free phase change compound
- Thick film offers ability to fill large gaps or unveven surfaces
- Low cost TIM solution
- Soft and compliant graphite substrate
- In-Plane (XY) thermal conductivity: 140 W/m-K
- Thru-plane (Z) thermal conductivity: 8.0 W/m-K
- Non-dielectric thermal pad
- Dual function capability (In-Plane XY and Thru-plane Z)
- Offers low surface resistance (phase change coating)
- Thixotropic compound design - silicone free design
- Designed for a range of flatness conditions
- Lightweight TIM pad solution
- Enhanced durability - resistant to handling
- Discrete phase change compound placement available
- 100% surface backed, discrete or edge adhesive tack options
- Offers a 100% non-metallic TIM pad solution
To request samples or download the technical data sheet, please click on the respective link located to the right or call:
TF: 1-888-989-3832 (US)
International: +1-949-369-7676.
Base Substrate Thickness
- GF.13 - 0.13mm | 0.005"
- GF.25 - 0.25mm | 0.010"
Coating Thickness (per side)
- F50-05 - 0.013mm | 0.0005" per each side
- See below for additional PCM coating thickness options
Standard Cross Section
Format: IntraGraph HS substrate coated both sides with a uniform thickness of phase change compound.
Typical Applications
General Specifications
- Battery Thermal Management
- High Power Density Energy Storage
- Automotive Inverter | Modules
- Consumer Electronics (mobile)
- LED | Lighting (commercial and consumer device)
- High End Electronics and Computing
- Displays
- Medical Electronics Assembly
- Robotics
- Microprocessor | Heat Sink
- Memory Module | Heat Sink
- Single or Multi-Device Pad Configurations
- EMI-Shielding
- Laser Diodes
- Phase Change Temperature: 50C
- Volumetric Expansion: 15%
- Compound Flow Design: Thixotropic
- In-Plane (XY) Thermal Conductivity: 140 W/m-K
- Thru-Plane (Z) Thermal Conductivity: 8.0 W/m-K
- Hardness: 85 (shore A)
- Volume resistivity: 11.0 x 10^--4 ohm-cm
- Dielectric constant: < 0.001 (@ 1 MHz)
- Maximum Operating Temperature: 150C (compound coating)
- Minimum Operating Temperature: -40C (compound coating)
- Material Color: Black
- Material Surface: Dry Compound Coating @ Room Temp
- Tack Options: Yes (PSA options listed at bottom)
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Thermal Impedance
Thermal impedance testing performed per ASTM D5470 Test Method.
GF.13-F50-05 0.152mm | 0.006"
20 PSI - 0.090 oC-in^2/W
40 PSI - 0.079 oC-in^2/W
80 PSI - 0.058 oC-in^2/W
100 PSI - 0.053 oC-in^2/W
120 PSI - 0.049 oC-in^2/W
GF.25-F50-05 0.279mm | 0.011"
20 PSI - 0.120 oC-in^2/W40 PSI - 0.090 oC-in^2/W80 PSI - 0.079 oC-in^2/W100 PSI - 0.075 oC-in^2/W120 PSI - 0.073 oC-in^2/W
Film Type | Film Thickness | Coating Thickness
Thermal impedance testing performed per ASTM D5470 Test Method. Contact us for additional pressure range figures.
Substrate
All IntraGraph PCM 50 (phase change) configurations utilize the IntraGraph HS substrate system.
Interested in a dry (no phase change coating) IntraGraph solution? Learn more about IntraGraph HS (no coating)
Coating Thicknesses
F05 - 0.013mm (0.5 mil) per side
F10 - 0.025mm (1.0 mil) per side
F13 - 0.032mm (1.25 mil) per side
Contact us for custom thickness.
Standard compound coating is Type F50 (50C) - contact us for more information on alternative or custom phase change coating.
Other Information
Material Formats
Master Rolls
Sheets
Die cut invidiual pads
Multiple die cut pads per master liner
Die cut continuous reels
Available Tack Backings
Optional acrylic pressure sensitive adhesive single side.
Optional edge strip pressure sensitive adhesive (outside of primary thermal via)
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.
Request Sample or Technical Data Sheet
Kapton is a registered trademark of Dupont Corporation