SILTEL SF-TC2.5 is an electrically insulating thermally conductive silicone film (fiberglass reinforced) for use between heat generating electronic devices and heat sink or case sink structures. SF-TC2.5 offers cost effective performance with a thermal conductivity of 2.5 W/m-K. SF-TC2.5 offers a reduction in thermal resistance during compression, high dielectric properties and excellent handling characteristics.
The fiberglass reinforcement allows the SF-TC2.5 to maintain its mechanical stability and good cut through resistance. With the ability to apply optional pressure sensitive adhesive to one or both sides of the silicone film for assembly allows the SF-TC2.5 film to be a cost-effective thermal interface material for a wide range of electronic assembly applications.
SILTEL SF-TC2.5 is available as log rolls, slit rolls or TIMTEL die cuts to match a wide range of industry standard or customer defined outlines.