SILTEL SG-TC11.0 THERMALLY CONDUCTIVE GAP PAD

SILTEL SG-TC11.0 Thermally Conductive Soft Silicone Gap Pad

SILTEL SG-TC11.0 is an electrically insulating thermally conductive silicone gap filler material ideal for use in electronic applications where thermal transfer over large gaps, large tolerances or creating surface contact to multiple device surfaces/heights must be achieved. Due to the specific formulation and ceramic particle filler loading, SG-TC11.0 demonstrates reliable thermal conductivity packaged with pad compliance all within a robust elastomer design. At low pressure, it quickly begins to fill surface gaps which significantly minimizes resistance leading to efficient and reliable heat transfer. SILTEL SG-TC11.0 is available in sheets or TIMTEL cut parts to match a wide range of industry standard or customer defined outlines.
SILTEL SG-TC11.0 Features and Benefits
  • High Thermal Conductivity - 11.0 W/m-K
  • Hardness: 64 (shore 00)
  • Soft and compliable pad design
  • Electrically insulating thermal pad solution
  • Excellent gap filling properties
  • Ideal for managing a range of flatness conditions
  • Operates at low pressure
  • High chemical resistance
  • Offers high temperature stability
  • Standard double side tack configuration
  • Availabe in sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
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Material Thickness

  • SG1.0-TC11.0 (1.00mm)
  • SG1.5-TC11.0 (1.50mm)
  • SG2.0-TC11.0 (2.00mm)
Format: Unsupported ceramic filled silicone pad

Standard Cross Section

Typical Applications

General Specifications

  • SMD Packages
  • Through Hole Vias
  • Capacitors
  • Heat Pipes
  • Multi-Chip Configurations
  • Interface Gap Management
  • Automotive Electronics
  • Consumer Electronics
  • Medical Electronics
  • Heat Sink | Case Sink
  • Coating: Ceramic filled silicone
  • Support: none
  • Operating Temperautre: -50C to 180C
  • Material Color: Light Gray
  • Gap Pad Surface: Light tack both sides
  • Tack Back Options: None

Compliance

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant

Technical Specifications

Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SG1.0-TC11.0 (1.00mm)
Thermal Impedance 0.17 oC-in^2/W @ 0.90mm thickness 0.15 oC-in^2/W @ 0.70mm thickness Dielectric Strength >10 kV/mm Volume Resitivity 7.0 x 10^11
SG1.5-TC11.0 (1.50mm)
Thermal Impedance0.24 oC-in^2/W @ 1.40mm thickness0.23 oC-in^2/W @ 1.20mm thickness
Dielectric Strength>10 kV/mm
Volume Resitivity7.0 x 10^11
SG2.0-TC11.00 (2.00mm)
Thermal Impedance0.30 oC-in^2/W @ 1.80mm thickness0.27 oC-in^2/W @ 1.60mm thickness
Dielectric Strength>10 kV/mm
Volume Resitivity7.0 x 10^11

Other Information

Material Formats
Sheets Die cut invidiual pads Multiple die cut pads per master liner
Available Tack Backings
No single side tack options available Note: standard pad configuration is double side light tack
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use. Shelf life is 2 years from date of manufacture.
Request Sample or Technical Data Sheet
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