SILTEL SG-TC1.5 THERMALLY CONDUCTIVE GAP PAD
SILTEL SG-TC1.5 Thermally Conductive Soft Silicone Gap Pad
SILTEL SG-TC1.5 is an electrically insulating thermally conductive silicone gap filler material ideal for use in electronic applications where thermal transfer over large gaps, large tolerances or creating surface contact to multiple device surfaces/heights must be achieved. Due to the specific formulation and ceramic particle filler loading, SG-TC1.5 demonstrates reliable thermal conductivity packaged with pad compliance all within a robust elastomer design.
At low pressure, it quickly begins to fill surface gaps which significantly minimizes resistance leading to efficient and reliable heat transfer.
SILTEL SG-TC1.5 is available in sheets or TIMTEL cut parts to match a wide range of industry standard or customer defined outlines.
SILTEL SG-TC1.5 Features and Benefits
- Thermal Conductivity - 1.5 W/m-K
- Hardness: 65 (shore 00)
- Soft and compliable pad design
- Electrically insulating thermal pad solution
- Excellent gap filling properties
- Ideal for managing a range of flatness conditions
- Operates at low pressure
- High chemical resistance
- Offers high temperature stability
- Availabe in sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
Material Thickness
- SG.50-TC1.5 (0.50mm)
- SG1.0-TC1.5 (1.00mm)
- SG2.0-TC1.5 (2.00mm)
- SG3.0-TC1.5 (3.00mm)
Format: Unsupported ceramic filled silicone pad
Standard Cross Section
Typical Applications
General Specifications
- SMD Packages
- Through Hole Vias
- Capacitors
- Heat Pipes
- Multi-Chip Configurations
- Interface Gap Management
- Automotive Electronics
- Consumer Electronics
- Medical Electronics
- Heat Sink | Case Sink
- Coating: Ceramic filled silicone
- Support: none
- Operating Temperature: -50C to 150C
- Material Color: Pink
- Gap Pad Surface: Dry Surface
- Tack Back Options: None
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SG.50-TC1.5 (0.50mm)
Thermal Impedance
10 PSI - 0.970 oC-in^2/W
30 PSI - 0.830 oC-in^2/W
60 PSI - 0.710 oC-in^2/W
Dielectric Strength
9.0 kV/mm
Volume Resitivity
1.6 x 10^13 ohm-cm
SG1.0-TC1.5 (1.00mm)
Thermal Impedance10 PSI - 0.970 oC-in^2/W30 PSI - 0.830 oC-in^2/W60 PSI - 0.710 oC-in^2/W
Dielectric Strength9.0 kV/mm
Volume Resitivity1.6 x 10^13 ohm-cm
Dielectric Strength9.0 kV/mm
Volume Resitivity1.6 x 10^13 ohm-cm
SG2.0-TC1.5 (2.00mm)
Thermal Impedance10 PSI - 2.500 oC-in^2/W30 PSI - 2.080 oC-in^2/W60 PSI - 1.820 oC-in^2/W
Dielectric Strength9.0 kV/mm
Volume Resitivity1.6 x 10^13 ohm-cm
Dielectric Strength9.0 kV/mm
Volume Resitivity1.6 x 10^13 ohm-cm
SG3.0-TC1.5 (3.00mm)
Thermal Impedance10 PSI - 3.540 oC-in^2/W30 PSI - 2.870 oC-in^2/W60 PSI - 2.450 oC-in^2/W
Dielectric Strength9.0 kV/mm
Volume Resitivity1.6 x 10^13 ohm-cm
Dielectric Strength9.0 kV/mm
Volume Resitivity1.6 x 10^13 ohm-cm
Other Information
Material Formats
Sheets
Die cut invidiual pads
Multiple die cut pads per master liner
Available Tack Backings
No tack options available
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.