SILTEL SG-TC2.8 THERMALLY CONDUCTIVE GAP PAD

SILTEL SG-TC2.8 Thermally Conductive Soft Silicone Gap Pad

SILTEL SG-TC2.8 is an electrically insulating thermally conductive silicone gap filler material ideal for use in electronic applications where thermal transfer over large gaps, large tolerances or creating surface contact to multiple device surfaces/heights must be achieved. Due to the specific formulation and ceramic particle filler loading, SG-TC2.8 demonstrates reliable thermal conductivity packaged with pad compliance all within a robust elastomer design. At low pressure, it quickly begins to fill surface gaps which significantly minimizes resistance leading to efficient and reliable heat transfer. SILTEL SG-TC2.8 is available in sheets or TIMTEL cut parts to match a wide range of industry standard or customer defined outlines.
SILTEL SG-TC2.8 Features and Benefits
  • Thermal Conductivity - 2.8 W/m-K
  • Hardness: 65 (shore 00)
  • Soft and compliable pad design
  • Electrically insulating thermal pad solution
  • Excellent gap filling properties
  • Ideal for managing a range of flatness conditions
  • Operates at low pressure
  • High chemical resistance
  • Offers high temperature stability
  • Standard double side tack configuration
  • Availabe in sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
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Material Thickness

  • SG.50-TC2.8 (0.50mm)
  • SG1.0-TC2.8 (1.00mm)
  • SG2.0-TC2.8 (2.00mm)
  • SG3.0-TC2.8 (3.00mm)
Format: Unsupported ceramic filled silicone pad

Standard Cross Section

Typical Applications

General Specifications

  • SMD Packages
  • Through Hole Vias
  • Capacitors
  • Heat Pipes
  • Multi-Chip Configurations
  • Interface Gap Management
  • Automotive Electronics
  • Consumer Electronics
  • Medical Electronics
  • Heat Sink | Case Sink
  • Coating: Ceramic filled silicone
  • Support: none
  • Operating Temperautre: -40C to 200C
  • Material Color: Gray
  • Gap Pad Surface: Light tack both sides
  • Tack Back Options: A1 (light tack single side only)

Compliance

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant

Technical Specifications

Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SG.50-TC2.8 (0.50mm)
Thermal Impedance 10 PSI - 0.570 oC-in^2/W 30 PSI - 0.480 oC-in^2/W 60 PSI - 0.410 oC-in^2/W Dielectric Strength > 10.0 kV/mm Volume Resitivity > 1.0 x 10^10 ohm-cm
SG1.0-TC2.8 (1.00mm)
Thermal Impedance10 PSI - 0.730 oC-in^2/W30 PSI - 0.650 oC-in^2/W60 PSI - 0.580 oC-in^2/W
Dielectric Strength> 10.0 kV/mm
Volume Resitivity> 1.0 x 10^10 ohm-cm
SG2.0-TC2.8 (2.00mm)
Thermal Impedance10 PSI - 1.370 oC-in^2/W30 PSI - 1.220 oC-in^2/W60 PSI - 1.130 oC-in^2/W
Dielectric Strength> 10.0 kV/mm
Volume Resitivity> 1.0 x 10^10 ohm-cm
SG3.0-TC2.8 (3.00mm)
Thermal Impedance10 PSI - 1.940 oC-in^2/W30 PSI - 1.770 oC-in^2/W60 PSI - 1.600 oC-in^2/W
Dielectric Strength> 10.0 kV/mm
Volume Resitivity> 1.0 x 10^10 ohm-cm

Other Information

Material Formats
Sheets Die cut invidiual pads Multiple die cut pads per master liner
Available Tack Backings
A1 - single side light tack by film lamination Note: standard pad configuration is double side light tack
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use. Shelf life is 2 years from date of manufacture.
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