SILTEL SG-TC2.8 Thermally Conductive Soft Silicone Gap Pad
- Thermal Conductivity - 2.8 W/m-K
- Hardness: 65 (shore 00)
- Soft and compliable pad design
- Electrically insulating thermal pad solution
- Excellent gap filling properties
- Ideal for managing a range of flatness conditions
- Operates at low pressure
- High chemical resistance
- Offers high temperature stability
- Standard double side tack configuration
- Availabe in sheets or die cuts
Material Thickness
- SG.50-TC2.8 (0.50mm)
- SG1.0-TC2.8 (1.00mm)
- SG2.0-TC2.8 (2.00mm)
- SG3.0-TC2.8 (3.00mm)
Standard Cross Section
Typical Applications
General Specifications
- SMD Packages
- Through Hole Vias
- Capacitors
- Heat Pipes
- Multi-Chip Configurations
- Interface Gap Management
- Automotive Electronics
- Consumer Electronics
- Medical Electronics
- Heat Sink | Case Sink
- Coating: Ceramic filled silicone
- Support: none
- Operating Temperautre: -40C to 200C
- Material Color: Gray
- Gap Pad Surface: Light tack both sides
- Tack Back Options: A1 (light tack single side only)
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
SG.50-TC2.8 (0.50mm)
SG1.0-TC2.8 (1.00mm)
Dielectric Strength> 10.0 kV/mm
Volume Resitivity> 1.0 x 10^10 ohm-cm
SG2.0-TC2.8 (2.00mm)
Dielectric Strength> 10.0 kV/mm
Volume Resitivity> 1.0 x 10^10 ohm-cm
SG3.0-TC2.8 (3.00mm)
Dielectric Strength> 10.0 kV/mm
Volume Resitivity> 1.0 x 10^10 ohm-cm