SILTEL SG-TC3.0S Ultra Soft Thermally Conductive Gap Pad
- Thermal Conductivity - 3.0 W/m-K
- Ultra Soft Design: 30 (shore 00)
- Extremely soft and compliable pad design
- Electrically insulating thermal pad solution
- Excellent gap filling properties
- Ideal for managing a range of flatness conditions
- Operates at low pressure
- High chemical resistance
- Offers high temperature stability
- Standard single side light tack pad configuration
- Optional tack laminate second side (SG-TC3.0S-A1)
- Availabe in sheets or die cuts
Material Thickness
- SG1.0-TC3.0S (1.00mm)
- SG2.0-TC3.0S (2.00mm)
- SG3.0-TC3.0S (3.00mm)
- Additional 5mm thickness available upon request
Standard Cross Section
Typical Applications
General Specifications
- SMD Packages
- Through Hole Vias
- Capacitors
- Heat Pipes
- Multi-Chip Configurations
- Interface Gap Management
- Automotive Electronics
- Consumer Electronics
- Medical Electronics
- Heat Sink | Case Sink
- Coating: Ceramic filled silicone
- Support: None
- Operating Temperautre: -40C to 200C
- Material Color: Ligh Pink
- Gap Pad Surface: Double sided light tack
- Tack Back Options: A1 (added single side tack option)
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
SG1.0-TC3.0S (1.00mm)
SG2.0-TC3.0S (2.00mm)
Dielectric Strength> 10 kV/mm
Volume Resisitivity1.0 x 10^10
SG3.0-TC3.0S (3.00mm)
Dielectric Strength> 10 kV/mm
Volume Resisitivity1.0 x 10^10