SILTEL SG-TC2.4 THERMALLY CONDUCTIVE ULTRA SOFT PAD

SILTEL SG-TC2.4 Ultra Soft Thermally Conductive Gap Pad

SILTEL SG-TC2.4 is an electrically insulating thermally conductive ULTRA Soft silicone gap filler material ideal for use in electronic applications where thermal transfer over large gaps, large tolerances or creating surface contact to multiple device surfaces/heights must be achieved. Due to the specific formulation and ceramic particle filler loading, SG-TC2.4 demonstrates reliable thermal conductivity packaged with high surface compliance all within an extremely conformable elastomer design. Double side tack configuration is standard. SG-TC2.4 is available with an optional single side tack fiberglass reinforced lamination for added handling along with a more aggressive tack to one side (version SG-TC2.4-GF). At low pressure, it quickly begins to fill surface gaps which significantly minimizes resistance leading to efficient and reliable heat transfer. SILTEL SG-TC2.4 is available in sheets or TIMTEL cut parts to match a wide range of industry standard or customer defined outlines.
SILTEL SG-TC2.4 Ultra Soft Features and Benefits
  • Thermal Conductivity - 2.4 W/m-K
  • Ultra Soft Design: 15 (shore 00)
  • Extremely soft and compliable pad design
  • Electrically insulating thermal pad solution
  • Excellent gap filling properties
  • Ideal for managing a range of flatness conditions
  • Operates at low pressure
  • High chemical resistance
  • Offers high temperature stability
  • Standard single side light tack pad configuration
  • Optional tack fiberglass laminate second side (SG-TC2.4-GF)
  • Availabe in sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
request samples | data sheet

Material Thickness

  • SG.50-TC2.4 (0.50mm)
  • SG1.0-TC2.4 (1.00mm)
  • SG2.0-TC2.4 (2.00mm)
  • SG3.0-TC2.4 (3.00mm)
  • Additional 5mm and 10mm thickness available upon request
Format: Unsupported ceramic filled silicone (standard).

Standard Cross Section

Typical Applications

General Specifications

  • SMD Packages
  • Through Hole Vias
  • Capacitors
  • Heat Pipes
  • Multi-Chip Configurations
  • Interface Gap Management
  • Automotive Electronics
  • Consumer Electronics
  • Medical Electronics
  • Heat Sink | Case Sink
  • Coating: Ceramic filled silicone
  • Support: None
  • Operating Temperautre: -40C to 200C
  • Material Color: Light Red
  • Gap Pad Surface: Double sided light tack
  • Tack Back Options: GF (single side fiberglass tack option)

Compliance

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant

Technical Specifications

Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SG.50-TC2.4 (0.50mm)
Thermal Impedance 10 PSI - 0.630 oC-in^2/W 30 PSI - 0.530 oC-in^2/W 60 PSI - 0.440 oC-in^2/W Dielectric Strength 4 kV/mm Volume Resisitivity 1.7 x 10^13
SG1.0-TC2.4 (1.00mm)
Thermal Impedance10 PSI - 1.260 oC-in^2/W30 PSI - 1.150 oC-in^2/W60 PSI - 1.000 oC-in^2/W
Dielectric Strength4 kV/mm
Volume Resisitivity1.7 x 10^13
SG2.0-TC2.4 (2.00mm)
Thermal Impedance 10 PSI - 2.030 oC-in^2/W 30 PSI - 1.790 oC-in^2/W 60 PSI - 1.490 oC-in^2/W Dielectric Strength 4 kV/mm Volume Resisitivity 1.7 x 10^13
SG3.0-TC2.4 (3.00mm)
Thermal Impedance10 PSI - 2.770 oC-in^2/W30 PSI - 2.500 oC-in^2/W60 PSI - 2.050 oC-in^2/W
Dielectric Strength4 kV/mm
Volume Resisitivity1.7 x 10^13

Other Information

Material Formats
Sheets Die cut invidiual pads Multiple die cut pads per master liner
Available Tack Backings
GF - single side tack option by fiberglass reninforced lamination. Adds more aggressive tack 1 side and addtional handling characteristics. Note: standard pad configuration is light tack on both sides
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use. Shelf life is 2 years from date of manufacture.