SILTEL SG-TC2.4 Ultra Soft Thermally Conductive Gap Pad
- Thermal Conductivity - 2.4 W/m-K
- Ultra Soft Design: 15 (shore 00)
- Extremely soft and compliable pad design
- Electrically insulating thermal pad solution
- Excellent gap filling properties
- Ideal for managing a range of flatness conditions
- Operates at low pressure
- High chemical resistance
- Offers high temperature stability
- Standard single side light tack pad configuration
- Optional tack fiberglass laminate second side (SG-TC2.4-GF)
- Availabe in sheets or die cuts
Material Thickness
- SG.50-TC2.4 (0.50mm)
- SG1.0-TC2.4 (1.00mm)
- SG2.0-TC2.4 (2.00mm)
- SG3.0-TC2.4 (3.00mm)
- Additional 5mm and 10mm thickness available upon request
Standard Cross Section
Typical Applications
General Specifications
- SMD Packages
- Through Hole Vias
- Capacitors
- Heat Pipes
- Multi-Chip Configurations
- Interface Gap Management
- Automotive Electronics
- Consumer Electronics
- Medical Electronics
- Heat Sink | Case Sink
- Coating: Ceramic filled silicone
- Support: None
- Operating Temperautre: -40C to 200C
- Material Color: Gray
- Gap Pad Surface: Double sided light tack
- Tack Back Options: GF (single side fiberglass tack option)
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
SG.50-TC2.4 (0.50mm)
SG1.0-TC2.4 (1.00mm)
Dielectric Strength4 kV/mm
Volume Resisitivity1.7 x 10^13
SG2.0-TC2.4 (2.00mm)
SG3.0-TC2.4 (3.00mm)
Dielectric Strength4 kV/mm
Volume Resisitivity1.7 x 10^13