XOPHASE 45 PHASE CHANGE THERMAL INTERFACE FILM

XoPhase45 Phase Change Thermal Interface Film

XoPhase 45 is a free standing 45C phase change thermal film designed to provide reliable and efficient heat transfer for a variety of electronic device applications including LED, thermoelectric modules or microprocessor/sink assembly. Available standard as either a 5 mil, 8 mil or 12 mil thick free standing phase change film, XoPhase 45 is ideal for ultra-flat surfaces with a flatness condition of ~ 0.002” (0.051mm) or less within lower pressure applications. Upon initial phase change, XoPhase 45 begins its controlled flow from its original pre-formed die cut size adjusting for surface irregularities and flatness conditions leading to improved thermal performance.
XoPhase 45 Film Features and Benefits
  • Thermal conductivity - 3.0 W/m-K
  • 45C phase change temperature
  • Ideal for ultra-flat interface surfaces
  • Low thermal impedance at lower pressure
  • Thixotropic -silicone free compound design
  • Easy to apply | release liner tab system
  • Excellent replacement for thermal greases
  • Reworkable after phase change
  • Metal foil substrate coating optoins available
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
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Material Thickness

  • X45-5 (0.13mm)
  • X45-8 (0.20mm)
  • X45-12 (0.30mm)
Format: Free standing phase change thermal inteface film with release liner.

Standard Cross Section

Typical Applications

General Specifications

  • Thermoelectric modules
  • LED Assembly
  • Clip Mount Heat Sinks
  • CPU | Heat Sink Assembly
  • Microelectronics
  • Consumer Electronics
  • Automotive Electronics
  • Medical Device Electronics
  • Heat Pipe Assembly
  • Servo Drive Controls
  • Ultra-flat surfaces | Thermal grease replacement
  • Phase Change Temperature: 45C
  • Thermal Conductivity: 3.0 W/m-K
  • Compound Flow Design: Thixotropic
  • Maximum Operating Temperautre: 120C
  • Material Color: Gray
  • Material Surface: Slight Tack

Compliance

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant

Release Liner | Thermal Pad Transfer System

When designing X45 to achieve excellent thermal transfer results, the thermal performance was not the only target. An additional key advantage in using X45 is the offering of the TIMTEL Die Cut Thermal Pad Transfer System. The purpose of this die cut design was to avoid common installation issues typically experienced by similar phase change thermal pads on the market place today such as not releasing properly from the liner and pad tearing. No direct handling of the PCM film is required by the operator. Place pad down on interface using carrier liner, apply slight pressure and remove liner.

Thermal Impedance

Thermal impedance testing performed per ASTM D5470 Test Method. Contact us for additional pressure range figures.
X45-5 (0.13mm)
10 PSI - 0.0173 oC-in^2/W 20 PSI - 0.0143 oC-in^2/W 40 PSI - 0.0109 oC-in^2/W
X45-8 (0.20mm)
10 PSI - 0.0200 oC-in^2/W20 PSI - 0.0159 oC-in^2/W40 PSI - 0.0126 oC-in^2/W
X45-12 (0.30mm)
20 PSI - 0.0220 oC-in^2/W40 PSI - 0.0174 oC-in^2/W80 PSI - 0.0140 oC-in^2/W

Other Information

Material Formats
Sheets Die cut invidiual pads Multiple die cut pads per master liner
Optional Substrate Coatings
Aluminum foil Copper foil Stainless steel foil Graphite heat spreader foil 100% surface or discrete placement
Storage | Shelf Life
Store material in a cool, dry location at 80F / 27C or below in original packaging until use. Shelf life is 1 year from date of manufacture.
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