Material Thickness
- X45-5 (0.13mm)
- X45-8 (0.20mm)
- X45-12 (0.30mm)
Format: Free standing phase change thermal inteface film with release liner.
Standard Cross Section
Release Liner | Thermal Pad Transfer System
When designing X45 to achieve excellent thermal transfer results for low pressure applications such as TEC modules, the thermal performance was not the only target. An additional key advantage in using X45 is the offering of the TIMTEL Die Cut Thermal Pad Transfer System.
The purpose of this die cut design was to avoid common installation issues typically experienced by similar phase change thermal pads on the market place today such as not releasing properly from the liner and pad tearing.
No direct handling of the PCM film is required by the operator. Place pad down on interface using carrier liner, apply slight pressure and remove liner.
